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Mycronic/RoyoTech SMD 200 Component Storage Tower 2017 #899.31 · Reel Dia Component tape width Reel Quantity 7'' 8mm · 7'' 12mm · 7'' 16mm · 7'' 24mm · 13'' 12mm · 13'' 16mm · 13'' 24mm · 13'' 44mm · TOTAL

Mydata Electrodesign Large board (24-29") x 59" transfer conveyors. Can be purchased as a set or individually. · Model:  MB906 DOM: 2011 

Pair of matching Mydata Electrodesign Large board (24-29") x 59" transfer conveyors. Can be purchased as a set or individually. · Model:  MB906 DOM: 2011 

Nikon Eclipse L200D Semiconductor Microscope #920123 · Supports both episcopic and diascopic illumination techniques · Nikon Eclipse 8x8 Stage XY clutch control · Includes glass and separate rotating wafer holder (L2-S8WH 8 inch) · Nikon Digital Sight L2 imaging controller w/DS-Fi1(5MP 12bit color camera) · 6 Objectives included: · LU Plan Fluor 5x/0.15   WD 18 · LU Plan Fluor 10x/0.30  WD 15 · LU Plan Fluor 20x/0.45 ∞/0 BD · LU Plan Fluor 50x/0.80 ∞/0 BD · LU Plan Fluor 100x/0.90 ∞/0 BD · Nikon 100x/0.90 WD 2.0

Nikon X-Tek XT V 160 X-Ray -2010 -2018-A · System had tube replacement and software upgrade in 2022 (upgraded to Nikon Metrology version XT 5.4) · Tube:  NanoTech 160 kV / 20 W Transmissive tube.  Microfocus source with  · submicron feature recognition · Manipulation:  • 5-axis manipulator (X,Y,Z, Rotate, Tilt) · • 360° fly-around views while keeping region of interest consistently locked into the center of the field of view · • Tilt: 75 degree oblique view  · • Real-time imaging or automated inspection · Windows 7 OS · INSPECT-X CONTROL SOFTWARE  · Version XT 5.4 · • Minimum training time · • Board map for quick sample overview  · • Collision avoidance between all components of the system and sample

Nikon X-Tek XT V 160 X-Ray -2012 - JN2201 · Tube:  NanoTech 160 kV / 20 W Transmissive tube.  Microfocus source with  · submicron feature recognition · Manipulation:  • 5-axis manipulator (X,Y,Z, Rotate, Tilt) · • 360° fly-around views while keeping region of interest consistently locked into the center of the field of view · • Tilt: 75 degree oblique view  · • Real-time imaging or automated inspection · Windows 7 OS · INSPECT-X CONTROL SOFTWARE  · Version XT 3.1.12 · • Minimum training time · • Board map for quick sample overview  · • Collision avoidance between all components of the system and sample

Nordson Dage Ruby · Model : XD7600NT X-Ray · X-Plane · 10 watt Tube  · Tube was replaced 2023 and has had 30 hours of use since.  · YR : 2012 · SN# X212912 

Open Tube  · 160KVa, 3 Watts  · With CT capability and VGSTUDIO 3.1 

Nordson DAGE XD7600NT 160KV X-ray System  · SN: X125510 - YOM: 2010 · Windows 7 OS  · DAGE NT maintenance-free, sealed-transmissive x-ray tube  · 200-230V 16A Single phase 

Nordson Dage XD7800 - Large Board Xray - 160KV #20289 · XD7800 - SN: X20289  YOM: 2009 · OS: Window 7 Ultimate · Max KV: 160KV  · 70 degree oblique viewing · Maximum board size 24.3” x 33” (617 x 838 mm) - Maximum inspection area 24” x 30” (610 x 762 mm) · Max sample weight: 22lbs (10 Kg) · Power: Single phase, 200 – 230V AC, 16A max. · System footprint (W x D x H) 2400 x 1975 x 2060 mm Weight: 3000Kg  · Condition : Refurbished

Brand : Nordson March · Model : FlexTRAK CD Plasma Cleaner · DOM 02.2024 · SN# 161167 · Condition : Like new · The FlexTRAK-CD system features a plasma chamber that can process up to 5 strips · per plasma cycle. All substrate areas receive uniform treatment while maintaining · tight control over process parameters for repeatable results. Also included in the · system is a patented plasma module for exceptional uniformity and run-to-run process · repeatability. · Chamber Volume : FlexTRAK-CD: 5.5 liters (338 in³) · Work Area : FlexTRAK-CD: 305W x 305D mm (12W x 12D in.) · Key Applications :  · Plasma Contamination Removal and Cleaning · • Fluorine and other halogens. · • Metals and metal oxides. · • Organic compounds.  · Plasma Etching and Surface Roughening · • Improve die adhesion and wire bonding. · • Improve mold adhesion and reduce delamination.  · Surface Activation · • Improve die adhesive flow, eliminate voids, and enhance adhesion. · • Improve mold material flow, eliminate voids, and reduce wire sweep. · • Improve underfill flow, eliminate voids, enhance adhesion, and increase wicking speed.

Nutek 1500mm 3 Stage Inspection Conveyor · 1.5 meter long - 3 stage 

Nutek NTM 530WS-XL 2000 -3 Work Station Conveyor # 2004-0483D01 · > Foot rest. · > LED overhead lighting.

NUTEK NTM410M-1500-1 1.5M single stage transfer for 48" led panels · M-size width - 10"  · variable speed control  · 2012 vintage  · 2 - identical units available 

OAL Associates IRC/R-1MT-18/48-6LS Head Shrink Tunnel Oven  · 480V 3 phase 14.5 amps 

Omron VT-RNS-II Inline AOI Machine · 120V  Single phase  · Max board 18x20"  · Board size : L · SN# 2014911-6058 · Good working order  · M size L size P/Z/S Image signal · input unit Camera 3-CCD camera Illumination Ring-shaped LEDs (R, G, B) Image resolution 10, 15, 20 μm Main unit Feed method Belt Line height 900 ±15 mm PCB carrier width · adjustment Automatic PCB fixing method Outer frame Power supply AC 100/115 V /120 V/200 V/220 V/230 V/240 V ±10% (single phase) Air 0.4 to 0.6 Mpa Ambient operating temperature +10 to +35°C Ambient operating humidity 35 to 80% RH (with no condensation) Weight Approx. 500 kg Approx. 650 kg Dimensions 700 (W) × 900 (D) × 1,600 (H) mm · (Excluding Patlite signal tower) 920 (W) × 1,365 (D) × 1,600 (H) mm · (Excluding Patlite signal tower)

DOM: 5/2022 · PC & SW license included. 

Orthodyne 3600 Plus Wire Bonder · - Heavy Ribbon · - Z Travel: 50 mm · - Theta Travel: +/- 220° · - Focus: 30 mm (Programmable Range) · - Stereo zoom microscope with adjustable work distance · - Monitor: Flat Panel, 17" · - Transducer, 60/80 kHz · - Forcer: 50 - 1500 gr · - Wire Range: 100 to 500 µm · - Maximum Wire Looping: 40.0 mm · - Die Rotation: +/- 70° · - Pattern Recognition Type:Enhanced OE GS III · - Ethernet · - USB · - Hard Disk Drive (HDD) · - Footprint: 680 mm x 1308 mm · - CE Certification · - Operating System: VX Works and Windows XP · - Power Consumption: 5 A at 230 V · - Power Requirement: 180-240 VAC, Single Phase, 50/60 Hz · Bond Area: · - X: 250 mm · - Y: 150 mm

OSAI Automation Neo Router w/BOFA Dust Extractor & Thermo Chiller - 2016 · YOM: 2016 SN: 28510 · Neorouter Modula is the solution for inline mechanical  separation of PCB’s. · The high flexibility in terms of configuration and fast setup  · Suitable for mass production volume but also for high mix lots.  · With:  BOFA  DP1000 Dust Extractor & Thermo Chiller  · Transp. SMEMA compliant · Max. conveyor width 350mm with automatic adjustment · Interface SMEMA · Operating side Front side · Panel length 70mm to 300mm (2.8” to 12”) with second stopper up to 480mm (19”) · Panel width 50mm to 350mm (2” to 13.8”) · Panel weight Up to 3kg (6.6lbs) · PCB conveyor 3mm flat belt · Panel thickness 0,5mm to 3,5mm (19.7mils to 137mils) · Panel clearance Up 100mm (4”) – Down 40mm (1.5”) · Working area 300mm (12”) x 350mm (13.8”) · Cutting area (Width) 320 mm (Up to 12,5") · Air pressure 6 bar (87 p.s.i.)   · Dimensions (LxWxH) 900mm x 2.765mm x 1.924mm (35.5” x 109” x 76”) · .5 meter conveyor pictured is not included.  

Panasonic NPM-DX High Volume Placer - 2019 ID: 290 · Vintage : 2019  · Model No. NM-EJM8D · SN: 1CSV0256  · 3 x NPM X 16 Nozzle Head V2 · 1 x 8 Nozzle heads  · Carts need to run the machines are included.  Feeders are available and can be purchased separately. 

Parmi SigmaX L 3D SPI  -2017 #SMB86617F  PFI: 236 · DOM: 10/20/2017 SN: SMLB86617F PFI ID: 236  · Key Specifications:  · Maximum PCB Size: 580 mm x 510 mm · Maximum PCB Weight: 5.0 kg · Resolution (X-Y): 10 x 10 um · Height Accuracy: 2 m on a certification target · Inspection Items: Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB Shrink · Board Thickness: 0.4 mm to 5 mm · Dimensions (L Model): 950mm x 1365mm x 1510mm

Flat belt conveyor 78” length / 24" width 

ESD Magazines  · PCB capacity : 50 pieces · Side guide slot: depth 4mm, width 5mm , pitch 10mm · Ref. Position : A=34mm ;B=34mm · Materials:  Conductive side panel, aluminum pillar, steel base. · With 2 stopper plate 1-50 slot number label. · Adjustable side pannel. · There are two styles, one uses a belt with 4 lead screws to adjust the movable panels(premium) - the other used a cam lock system(economy)

Pemtron ATHENA L 3D AOI - 2023 # A8HL23-21 PFI: 167 · SN:  A8HL23-21 DOM: 3/15/2023 PFI ID: 167 · Linear motor motion stage  · Max board size: 510 x 510 mm · Board thickness: .4 - 7.0mm · PCB Clearance: 50mm top and 50mm bottom  · O/S : Windows 10 Enterprise  · Optional Side cameras · Projection type 12(8+4) · 12MP View works camera · PCB Clearance: 50mm top and 50mm bottom  · Features per the OEM:  · Advanced 3D technology · Stable and Accurate 3D realization by installing additional projectors · - 3D Formation of Chip among Dense Components and Narrow Parts · - 3D image Formation identical to a Real Image · Improved Repeatability · - Accurate 3D inspection makes repeatability more reliable · Simultaneous Inspection Algorithm (2D and 3D) · Tele-centric Lens Offers Higher Accuracy & Detection · High-Speed CPU & Image Process · User-Friendly GUI

Pemtron ATHENA L 3D AOI - 2023 # A8HL23-22 PFI: 136 · DOM: 3/15/2023  · Linear motor motion stage  · Max board size: 510 x 510 mm · Board thickness: .4 - 7.0mm · PCB Clearance: 50mm top and 50mm bottom  · O/S : Windows 10 Enterprise  · Optional Side cameras · Projection type 12(8+4) · 12MP View works camera  · Features per the OEM:  · Advanced 3D technology · Stable and Accurate 3D realization by installing additional projectors · - 3D Formation of Chip among Dense Components and Narrow Parts · - 3D image Formation identical to a Real Image · Improved Repeatability · - Accurate 3D inspection makes repeatability more reliable · Simultaneous Inspection Algorithm (2D and 3D) · Tele-centric Lens Offers Higher Accuracy & Detection · High-Speed CPU & Image Process · User-Friendly GUI

Inline 3D SPI System · Windows 10 Operating System · Quantity: 1  · System Type: Color 3D Inline Solder Paste Inspection (SPI) [1] Vision Algorithm: 2D Vision Inspection + 3D PMP (Phase Measuring Profilometry) Algorithm [1] Camera / Resolution: 4MP camera with a 15 ㎛ X/Y Pixel Resolution [1] Inspection Speed: 32.73 ㎠/sec [1] Field of View (FOV): 30.7 x 30.7 mm [1] Height Range & Resolution: 0 ~ 450 ㎛ / 0.4 ㎛ [1] Repeatability & Accuracy: Height/Volume Repeatability: ±1% (3σ) Height Accuracy: 2 ㎛ Gage R&R: < 10% [1] PCB Size Compatibility: Min: 50 x 50 mm (2 x 2 inch) Max: 510 x 460 mm (20 x 18 inch) [1] PCB Thickness: 0.4 - 7 mm [1] Bottom Clearance: 27 mm [1] Max PCB Warpage: ±5 mm [1] Typical Load/Unload Time: 5 seconds [1]

InLine 3D SPI System  · Windows 10 Operating system

Pemtron TROI-7700HL 3D SPI - 2014# P7HL 13-031 PFI: 288 · DOM: 9/5/2014 SN:P7HL 13-031 PFI: 288