Bond Shear / Pull Testing

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Royce 650 Bond testing, Wire pull, and Shear testing
Royce
Royce 650 Bond testing, Wire pull, and Shear testing
In stock · Longwood, FL
Royce 650 Bond Shear Tester  · DOM : 2010 · Operating system upgraded  · Manuals included  · Mfg Specs :  · The Royce 650 Universal Bond Tester is a high-precision system designed for microelectronics bond testing, wire pull, and shear testing across semiconductor, automotive, and medical device manufacturing. · Key Performance Capabilities · Die Shear Force: Up to 200 kgf · Wire / Ball Pull Force: Up to 10 kgf · Ball Shear Force: Up to 5 kgf · Tweezer / Ball Pull Force: Up to 10 kgf · 3-Point Bend / Push Force: Up to 10 kgf · Applications: Wire pull, ball bond shear, die shear, solder ball (bump) shear, zone shear, tweezer pull, cold ball pull, stud pull, and heated testing
$ 13,500.00
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