Royce 650 Bond testing, Wire pull, and Shear testing
Royce 650 Bond testing, Wire pull, and Shear testing
Royce 650 Bond testing, Wire pull, and Shear testing
Royce 650 Bond testing, Wire pull, and Shear testing
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Royce 650 Bond testing, Wire pull, and Shear testingRoyce 650 Bond testing, Wire pull, and Shear testingRoyce 650 Bond testing, Wire pull, and Shear testingRoyce 650 Bond testing, Wire pull, and Shear testing

Royce 650 Bond testing, Wire pull, and Shear testing

royce
Price:
$ 13,500.00

Description

Royce 650 Bond Shear Tester 
DOM : 2010
Operating system upgraded 

Manuals included 

Mfg Specs : 

The Royce 650 Universal Bond Tester is a high-precision system designed for microelectronics bond testing, wire pull, and shear testing across semiconductor, automotive, and medical device manufacturing.

Key Performance Capabilities

  • Die Shear Force: Up to 200 kgf

  • Wire / Ball Pull Force: Up to 10 kgf

  • Ball Shear Force: Up to 5 kgf

  • Tweezer / Ball Pull Force: Up to 10 kgf

  • 3-Point Bend / Push Force: Up to 10 kgf

  • Applications: Wire pull, ball bond shear, die shear, solder ball (bump) shear, zone shear, tweezer pull, cold ball pull, stud pull, and heated testing

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