Royce 650 Bond testing, Wire pull, and Shear testing
Royce 650 Bond Shear Tester
DOM : 2010
Operating system upgraded
Manuals included
Mfg Specs :
The Royce 650 Universal Bond Tester is a high-precision system designed for microelectronics bond testing, wire pull, and shear testing across semiconductor, automotive, and medical device manufacturing.
Key Performance Capabilities
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Die Shear Force: Up to 200 kgf
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Wire / Ball Pull Force: Up to 10 kgf
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Ball Shear Force: Up to 5 kgf
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Tweezer / Ball Pull Force: Up to 10 kgf
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3-Point Bend / Push Force: Up to 10 kgf
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Applications: Wire pull, ball bond shear, die shear, solder ball (bump) shear, zone shear, tweezer pull, cold ball pull, stud pull, and heated testing
Condition details, check-out notes and close-up photos for this unit are available on request.
Machine as pictured. Options and details are confirmed on the formal quote.
PFI ships worldwide from Longwood, Florida. Shipping is quoted per order — request a quote. Crates, export packing and installation are quoted by request. Lead times vary by item, so please contact us prior to purchase.
This company strictly complies with all applicable United States export control laws, economic sanctions, and trade regulations.