Disco DAD 341 Automatic Dicing Saw Wafer / Substrate


Price:
$ 8,000
Stock:
In stock

Description

 Disco DAD 341 Dicing Saw 

  • Automatic mode for full wafer dicing.
  • Semi-automatic mode for custom cuts.
  • Measurement resolution: 0.1 µm.
  • Positioning accuracy: 0.5 µm.
  • Typical blade thickness (kerf): 35 µm to 200 µm.
  • 4mm max thickness


You may also like

Recently viewed