Disco DAD 341 Automatic Dicing Saw Wafer / Substrate

 Disco DAD 341 Dicing Saw 

• Automatic mode for full wafer dicing.
• Semi-automatic mode for custom cuts.
• Measurement resolution: 0.1 µm.
• Positioning accuracy: 0.5 µm.
• Typical blade thickness (kerf): 35 µm to 200 µm.
• 4mm max thickness