Description
IBL BLC 509 Vapor Phase Soldering Reflow Oven
DOM: 2016
SN: BLC509-05D08816
Features:
- 2-chamber Vapor Phase Soldering machine.
- Lead and lead free soldering with fast changeover.
- Maximum process window at minimum temperature.
- Easy and comfortable operation through touch screen monitor for programming.
- Live temperature profile monitoring, documentation and optimization with IBL Software VP-Control.
- Rapid cooling system.
- Observation window into process chamber
- Max board size: 540 x 540 x 80mm (H)
Power: 120/208V
Water Connection: 1/2"
DIMS: 1190 x 1960 x 1320 mm