Description
CyberOptics SE500-II 3D SPI
DOM: 2014 SN: 8021547
- 3D Solder Paste Inspection
- Max Inspection Area: 20”x19.8”
- Max PCB: 510 x 510 mm (20.0 x 20.0 in.)
- Min PCB: 50 x 50 mm (2.0 x 2.0 in.)
- 3.0 kg (6.6 lbs.)
- Board Edge Clearance: Top: 2.5 mm (0.10 in.), Bottom: 3.0 mm (0.12 in.)
- Component Clearance: Top (above belt): 20.1 mm (0.78 in.), Bottom: 25.4 mm (1.0 in.)
- Conveyor Speed: 150 - 450 mm/sec (5.9-17.7 in./sec)
- Conveyor Width Adjust: Automatic
- SMEMA
Dimensions: 39.5” x 50” x 55”H