Description
JUKI KE-2080E Fine Pitch Pick and Place - System has been serviced/calibrated and is in good working order.
- Includes TR6S Side mount tray feeder
- SN# #288-A1178
- High magnification VCS camera option installed
- 25mm part height max
- Trolley front and rear
Placement Speed:
- Chips (Laser Centering/IPC9850): Up to 16,700 CPH (Components Per Hour).
- IC Components (Vision Centering/Effective Tact): 1,850 CPH.
- IC Components (with MNVC option): Up to 4,860 CPH.
- Optimum Speed (Laser Centering): Up to 20,200 CPH.
Placement Accuracy:
- Laser Recognition: ± 0.05 mm (Cpk ≥ 1).
- Vision Recognition: ± 0.03 mm (Cpk ≥ 1), or ± 0.04 mm when using the optional Multi-Nozzle Vision Centering (MNVC).
Component Handling :
- Component Size: Laser Recognition: From 0402 (01005 imperial) to 33.5 mm square.
- Vision Recognition: From 1.0 mm x 0.5 mm up to 74 mm square or 50 mm x 150 mm.
- Component Height: Up to 25 mm.
Feeder Inputs: Maximum 80 (converted to 8 mm tape/feeder). The machine can also be configured with matrix tray changers for handling a wider variety of parts.
Board Handling : "E" in the model name often refers to the machine's capacity to handle E-size boards. E-size: Up to 510 mm x 460 mm. With long board option: Up to 800 mm x 460 mm.
Machine Specifications :
Placement Head: The KE-2080E typically features a multi-nozzle laser head (with 6 nozzles) for high-speed chip placement and a separate high-resolution vision head (with 1 nozzle) for larger, more complex components.
- Operating System: Windows XP Embedded.
- Power Supply: 200 to 415 VAC, 3-phase.
- Apparent Power: 3 kVA.
- Operating Air Pressure: 0.5 ± 0.05 MPa.
- Mass (Weight): Approximately 1,670 kg (for the E-size configuration).
- Dimensions (W x D x H): Approximately 1,730 mm x 1,600 mm x 1,490 mm.
Key Features:
- Dual XY Drive System: JUKI's "Full closed loop control" uses AC motors and magnetic linear encoders for precise and reliable motion.
- High-Resolution Vision Camera: This feature is crucial for accurately placing fine-pitch components like BGA, CSP, and QFP.
- Multi-Nozzle Vision Centering (MNVC): An optional feature that significantly increases the throughput of high-accuracy devices by allowing multiple vision-centered placements at once.
- "No-Blow" Placement Technology: This patented technology ensures gentle and accurate placement without the need for an air blow-off, which can dislodge small components.