F&K Delvotec G5 Wire Bonder -2017

F&K Delvotec G5 - Single 
Base sytem Plus itemized options as listed below:
YOM: 2017

• Bond process Control System BPC2000 Option 
• Deep Access Thin Wire bond head option 
• Thin Wire Spool Option 
• BPD Viewer Option 

Base System: 

Standard bonding area X/Y: 254mm x 152mm (10” x 6” )
Modular machine concept including:
Main components
Extremely rugged machine frame
Minimum dimensions of required floor space 1777 mm x 620 mm x 1273 mm -(height x width x depth)
Working height adjustable from 850mm -1050mm, fulfil SMEMA requirement (940 -965 mm)
Control and power electronics based on industry standards

• Pentium®M based cPCI CPU Unix®
• -based real time multi
• -tasking operating system
• high capacity hard disk drive (>60 GB, ruggedised system)
• standard network connectivity TCP/IP, SMEMA, SECS/GEM
• (SEMI E30), HSMS graphical multi - window user interface
• 19“ TFT flat screen monitor
• Menu controlled teach -in
• direct parameter input
• pattern recognition display
• process status & message display
• service interface
• linear drive X -Y table with 10“ x 6“ bond area
• X = 254 mm (10”); Y = 152 mm (6”); Z = 40 mm
• high resolution linear encoders in X and Y
• AC servo motor with absolute encoder in Z and P axes
• high speed numeric control system
• programmable dual source work area lighting
• electronic touch down sensor for every bond
• individual height sensing per component or bond pad
• Microscope: 
• stereo zoom
• adjustable
• light intensity
• Status Light
• easy programmable

Ultrasonic Generator

• digital F&K Delvotec ultrasonic system
• voltage, current or power controlled
• programmable from 30 to 250 kHz operating frequency
• up to 40 watts ultrasonic power output

pattern recognition unit PRU

• CCD camera with custom optics adapted to product
• moving camera in Z axis
• programmable focus for each recognition point
• Cognex®8000 Pat Max®system
• 256 greyscale processing
• pattern recognition
• edge recognition
• tilted image option
• programmable size search window
• 640 x 480 Pixel Camera
• process adjustment
• programme complexity virtually unlimited
• up to 150 chips recognition reference images
• up to 50.000 wires
• no restriction on bond height within work area
• programmable force / time ramp
• bond parameter settings
• offset values per program
• standard values per chip
• individual settings per bond
• loop shape settings
• automatic or programmed loop height setting
• automatic control of bond height
• standard values per program
• standard values per chip
• individual settings per wire work area lighting
• programme controlled type and intensity
• direct red LED standard

 Item is currently located in Portugal, under power and available for demo