Description
Koh Young Technology Zenith Lite Advanced 3D Inspection - 2019
SN AP-SX-00128 YOM 2019
Per the OEM: As the true 3D AOI system, ZENITH LiTE effectively measures solder joints and components in 3D, where traditional 2D inspection and true 3D measurement are combined in perfect unison, making inspection according to IPC-A-610 attainable.
ZENITH LiTE has the ability to make a clear and concise ‘go-or-no-go’ decision for a solder joint inspection, detecting an array of potential defects including Missing solder, Offset, Rotation, Polarity, Upside down, OCV/OCR, Solder filet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.