Fancort PHM1-1 Hot Bar Soldering / Bonding Flex to PCB, FLEX to LCD


Price:
$ 11,000
Stock:
In stock

Description

 Fancort PHM1-1 Hot Bar Soldering / Bonding 

Hot Bar Bonding & Soldering machines, easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB.

Thermode Specifications

Maximum Thermode Area - 400 mm2
Maximum Thermode Length - 100mm (normal)
Force Range - 30 N @ 0.09 MPa to 600 N @ 0.6 MPa
Thermode Stroke - 50 mm
Actuation Type - Pneumatic

 

Pulsed Heat Control Specifications

Temperature Range: 1° C Interval
Idle: 0 to 150° C
Preheat: 0 to 500° C
Reflow: 0 to 500° C
Time Periods: 1 Second Interval
Preheat: 0 to 200 Seconds
Reflow: 0 to 200 Seconds
Heating Rate Control: Eight (8) Selections
Programmable Heat Profiles: Four (4) Internal Memory
Thermode Cooling: Air For Cooling Thermode

SmarTherm HSM

• Compressed Air 4 to 6 Bar
• Vacuum Flow Rate 24 L/min Max mun
• Electrical Power 220 or 110 Vac (Factory Preset)
• Weight Net - 91kg, Gross 159kg

SmarTherm Product Handling

• Alignment Method Visual with CCD Camera (Optional)
• Product Fixture 2 Sets
• Table Rotating Method Manual (HSM 2-1); Pneumatic (HSM 2-2)
• Standard Working Area 200mm x 150mm
• Maximum Working Area 200mm x 260mm

 SmarTherm Heat Sealing Parameters

• Temperature Range 50° to 400° C
• Temperature Accuracy ± 1° C
• Bond Timer (selectable) 0 to 5, 0 to 12 or 0 to 30 Seconds
• Bond Air Pressure 1.2 to 6.0 Bar (0.1 to 0.6 MPa)
• Pressure Accuracy ±0.5 Bar (±0.05 MPa)
• Maximum Bond Force 1,175 N Maximum (up to 3,900 N Optional)

 

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